深圳市達宇實業(yè)有限公司東莞市達宇科技有限公司
- 全國服務(wù)熱線0755-81728487
| 項目 | 正常能力 | 先進能力 | |
| 內(nèi)層芯板厚度 | Min | 0.1mm | 0.1mm |
| Max | 2.0mm | 3.0mm | |
| 線寬線距 | Inner(1/3 or HOZ) | 4/3 mil +/- 20% | 2/2 mil +/- 10% |
| Outer(1/3 or HOZ) | 4/4 mil +/- 20% | 2/2 mil +/- 10% | |
| 阻抗控制 | --- | +/- 10% | +/- 5% |
| 銅厚 | Max | 3/3 Oz | 4/4 Oz |
| 完成板厚 | Max | 3.2mm | 3.5mm |
| 完成板厚公差 | >2.0mm and <3.0mm | +/- 0.18mm | +/- 8% |
| >1.0mm and <=2.0mm | +/- 0.13mm | +/- 8% | |
| <=1.0mm | +/- 0.10mm | +/- 0.05mm | |
| 層數(shù) | Max | 8 layers | 14 layers |
| 孔到銅間隙 | 4 layers | 7 mil | 6 mil |
| 6 layers | 8 mil | 6.5 mil | |
| 8 layers | 8 mil | 7 mil | |
| 小孔徑 | Min drill bit | 6 mil | 4 mil |
| 縱橫比 | Max | 8:1 | 10:1 |
| 字符寬度 | --- | 5 mil | 4 mil |
| V-cut余厚 | --- | +/- 6 mil | +/- 4 mil |
| 綠油 | Line to pad | 3 mil | 2 mil |
| Solder bridge | 4 mil | 3 mil | |
| Solder bridge(black ink) | 5 mil | 4 mil | |
| Registration | 2.5 mil | 1.5 mil | |
| 插件孔 | Size | +/- 3 mil | +/- 2 mil |
| 壓配孔 | Size | +/- 2 mil | +/- 2 mil |
| 孔位公差 | Positional | +/- 3 mil | +/- 2 mil |
| 非電鍍 孔完成公差 | Size | +/- 2 mil | +2/-0 or +0/-2 mil |
| 外形公差 | --- | +/- 5 mil | +/- 4 mil |
| HDI | |||
| 板厚 | Min | 0.4 mm | 0.35 mm |
| Max | 2.4 mm | 4.0 mm | |
| 盲孔類型 | --- | 2+N+2, BVH | 3+N+3, BVH |
| 樹脂塞孔小孔徑 | Min | 0.15 mm | 0.07 mm |
| Max | 0.8 mm | 1.5 mm | |
| 孔銅回填小孔徑 | Min | 0.07 mm | 0.07 mm |
| Max | 0.5 mm | 0.5 mm | |
| 鐳射鉆孔大小 | --- | 0.07 mm | 0.15 mm |
